Signature Analysis Framework Pillars

Pillar I: The Physics of the "Invisible" Signature

• Content: Based on the new Lissajous/Capacitance paper.

• Argument: Transient AC analysis allows for a "virtual deprocessing" of the device. By interpreting the Lissajous identity, an analyst can determine the state of the gate oxide, depletion regions, and channel formation without opening the package.

Pillar II: The Miniaturization & 3D Integration Paradox

• Content: Based on the 3D Integrated Power and 3-Phase Applications papers.

• Argument: As we move to 3D stacking and ultra-small footprints (FemtoFET), traditional failure modes are replaced by package-dominant thermal and mechanical stresses.

Pillar III: Non-Linearity and Design-Induced Reliability Risks

• Content: Based on the Multiphase Buck Converter and ESD Robustness papers.

• Argument: Modern design features (like integrated current sensing or self-protection Zeners) introduce new, non-linear failure modes where "good" electrical readings can mask underlying physical defects like solder voids or deep depletion.

Pillar IV: Universal Degradation in High-Power Semiconductors

• Content: Based on the ISTFA 2022 Laser conference paper.

• Argument: This synthesizes the portfolio by proving that the fundamental physics—specifically metal diffusion and thermal management—remains the ultimate reliability barrier whether the carrier is an electron (MOSFET) or a photon (Laser)